Good bond strength
Tough-hard formulation
Grindable
Fast-setting, solvent- and filler-free two-component epoxy resin adhesive of honey-like viscosity ideal for wood, metal, stone, rigid foams and many plastics.
Mixing ratio: 1 : 1 parts by weight / volume of resin to hardener.
Processing time: 10 minutes.
Loads can be applied to the bond after min. 1 h (at 25 °C).
The strength properties of the bonding grow up with increasing curing time and curing temperature.
