Heat-conducting adhesive (2x2ml), WLK DK 4
The heat-conducting adhesive from Fischer Elektronik is suitable for the safe and thermal bonding of electronic components such as high-power LEDs or mechanical components. It is a temperature-resistant, impact-resistant, solvent-free and thermally conductive epoxy-based two-component adhesive filled with aluminium oxide with a short pot life. The heat-conducting adhesive bonds porous and non-porous surfaces of metals, glass, ceramic materials and almost all plastics. The mixing (1:1) of hardener and binder is done by a static mixing tube with Luer-Lock system.
Thermal conductivity 1 W/mK
Mixing ratio: 1:1
Temperature range: -50° C to +145° C
Curing: approx. 16 hours at room temperature, 4 hours at 60° C
Further processing: after approx. 4-6 hours (depending on layer thickness)
1 syringe 4ml and 3 mixer WLK M 4.